TAIHO KOGYO TRIBOLOGY RESEARCH logo

Support for Conference Grant Program

TAIHO KOGYO TRIBOLOGY RESEARCH

Funding Amount

Up to US $10,000

Deadline

Rolling / Open

Grant Type

foundation

Overview

Support for Conference Grant Program

Status: ACTIVE
Funder: Taiho Kogyo Tribology Research Foundation
Amount: Up to US $10,000
Last Updated: November 11, 2025

Summary

The Support for Conference Grant Program assists in funding tribology-related conferences that promote the exchange of scientific and engineering knowledge rather than business profit. There is no set application due date, and grants can reach up to US$10,000 per year for conference organizers. Only organizers are eligible to apply, and it is possible to apply for multiple grants simultaneously. This program is managed by the Taiho Kogyo Tribology Research Foundation.

Overview

NOTE: No definite due date for application is set, but on a first-come-first-served basis. Objective Assist in funding tribology-related conferences which are expected to contribute to global / regional development of tribology. Conditions of Receiving Grant The conference must be held with the purpose of exchanging scientific and engineering information on tribology, not with the purpose of business profit. Memorial conference, or regularly held conference having special issues may be supported, but they shall not be supported in last five years. Note: It is possible to apply for both ”Support for Conference” and “Support for Young Tribologists” at the same time. Amount of Grant Max. US$10,000/year to conference organizers

Eligibility

You can learn more about this opportunity by visiting the funder's website. Only the conference organizers can apply for this support.

Focus Areas & Funding Uses

Fields of Work

science-research

Categories

Browse similar grants by category

Related Grants

Similar grants from this funder and related organizations

Ready to apply for Support for Conference Grant Program?

Grantable helps you assess fit, draft narratives, and track deadlines — so you can submit stronger applications, faster.