U.S. Embassy Bishkek Public Diplomacy Science, Technology, Engineering, and Mathematics (STEM) Grant

Funder: US Dept. of State: Under Secretary for Public Diplomacy & Public Affairs

The U.S. Embassy in Bishkek is seeking proposals to enhance STEM education and innovation in the Kyrgyz Republic. This initiative aims to expand rural educational opportunities, foster connections between U.S. and Kyrgyz STEM organizations, and promote American technological advancements. By addressing local needs, the program will create partnerships that boost economic opportunities in STEM fields while ensuring the U.S. remains a key partner in scientific innovation for Kyrgyzstan.

The U.S. Embassy in Bishkek’s Public Diplomacy Section (PDS) invites proposals that promote American leadership and innovation in Science, Technology, Engineering, and Math (STEM) in the Kyrgyz Republic. The United States is the global leader in STEM, from artificial intelligence and biotechnology to engineering, advanced manufacturing, and space science. For Kyrgyzstanis to harness innovations developed in the United States, there is an urgent need to expand rural STEM educational opportunities, prepare Kyrgyzstanis to use American technologies and methods, equip educators to teach STEM topics, and facilitate connections between Kyrgyzstani and U.S. STEM organizations. By focusing on these priorities, this program will create partnership opportunities for U.S. businesses, educational institutions, and investors in the Kyrgyz Republic’s rapidly growing tech sector. The program will increase the adoption of world-leading American technological and educational systems. The program will also promote American entrepreneurship and startup culture in the Kyrgyz Republic, addressing drivers of outmigration and decreasing reliance on outside aid by creating profitable domestic economic opportunities in STEM fields. Finally, the program will ensure the United States remains the partner of choice for scientific and technological innovation in the Kyrgyz Republic. Please follow all instructions below.