Microelectronics and Nanomanufacturing Certificate Program (MNCP)
Funding Amount
Free (fully funded by NSF grant)
Deadline
Rolling / Open
Grant Type
foundation
Overview
Microelectronics and Nanomanufacturing Certificate Program (MNCP)
Funder: National Science Foundation (NSF) project at Penn State University
Amount: Free - offered at no cost to eligible participants
Program Length: 12 weeks
Program Start: Fall (annually)
Overview: TC3 is one of seven community college partners across the country participating in an NSF-funded project to bring military veterans into the nanotechnology workforce. The program was created specifically for veterans and teaches the principles and practices needed to succeed in the semiconductor industry. The goal is to help meet the needs of growing microelectronics and semiconductor workforces in regions where semiconductor manufacturing is expanding.
- Live-streamed lectures delivered by Penn State's Center for Nanotechnology Education and Utilization (CNEU) faculty
- Hands-on lab work in the cleanroom environment at Cornell NanoScale Facility
- Upon completion, participants earn a Microelectronics and Nanomanufacturing Certificate from Penn State University
- Eligible to take three nanotechnology stackable certification exams administered by ASTM International
Program Features
- TC3 serves the regional veteran population in partnership with Cornell University
Geographic Scope
- United States military veterans
- Active duty military members
- Military spouses and dependents
Eligibility
- Program Administrator: Carrie Coates Whitmore, Director of Continuing Education and Workforce Development
- Email: biz@tompkinscortland.edu
- Program Offering: Through TC3 BIZ
Contact Information
How to Apply
Application Process
1. Contact TC3 BIZ for enrollment information
2. Program accepts applications from eligible veterans, active duty military, spouses, and dependents
3. 12-week program offered each fall
Required Materials
Contact biz@tompkinscortland.edu for specific application requirements and enrollment procedures.Focus Areas & Funding Uses
Fields of Work
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