CHIPS Incentives Program – Facilities for Semiconductor Materials and Manufacturing Equipment
Funding Amount
Not stated
Deadline
November 1, 2026
28 days left
Grant Type
Federal
Deadline history & next window
- Cycle
- Rolling — applications accepted year-round
- Current deadline
- November 1, 2026
- Tracked since
- April 2026
From the program guidelines: “The Department of Commerce may amend this NOFO at any time.”
Can we apply?
Check your organization against each line. Taken from the listing; confirm with the funder's guidelines.
Eligible organizations
- For purposes of this NOFO, a “covered entity” means a nonprofit entity; a private-sector entity; a consortium of private-sector entities; or a consortium of nonprofit, public, and private-sector entities with a demonstrated ability to substantially finance, construct, expand, or modernize a…
Required status
- Active SAM.gov registration (UEI)
Other requirements
- An applicant must be a “covered entity” to receive CHIPS Incentives.
Not eligible / not funded
- Not eligible: That lack sufficient scale to meaningfully
- Not eligible: 5 For the purposes of this NOFO, wafer manufacturing facilities are not considered semiconductor materials
- Not eligible: Certain purposes are ineligible uses for CHIPS Incentives.
- Not eligible: That lack sufficient scale to
- Not eligible: A cluster
- Not eligible: The
- Not eligible: Foreign entities of concern48 are not eligible to receive CHIPS Incentives.49 In addition, the
- Not eligible: no more than 5 pages (excluding attachments and appendices).
- Not eligible: 8 pages (excluding attachments to support details), the applicant should include the following:
- Not eligible: The plan for workforce and community investment should not exceed 8 pages in total, excluding
- Not eligible: determined to be ineligible, incomplete, or nonresponsive will be rejected.
- Not eligible: applications determined to be ineligible, incomplete, or nonresponsive will be returned to the
Overview
The CHIPS Incentives Program aims to catalyze long-term economically sustainable growth in the domestic semiconductor industry in support of U.S. economic and national security. This is the second Notice of Funding Opportunity under this program and seeks applications for projects for the construction, expansion, or modernization of commercial facilities for semiconductor materials and manufacturing equipment. For more information, additional resources, and instructions on how to apply, please visit chips.gov. Note that all applications must be submitted through the CHIPS Incentives Portal at https://applications.chips.gov . If you have any questions on how to apply, please email apply@chips.gov.
Details
- Agency: National Institute of Standards and Technology
- Department: Department of Commerce
- Opportunity #: 2023-NIST-CHIPS-SMME-01
- Instrument: cooperative_agreement
Eligibility
An applicant must be a “covered entity” to receive CHIPS Incentives. For purposes of this NOFO, a “covered entity” means a nonprofit entity; a private-sector entity; a consortium of private-sector entities; or a consortium of nonprofit, public, and private-sector entities with a demonstrated ability to substantially finance, construct, expand, or modernize a facility relating to the fabrication, assembly, testing, advanced packaging, production, or research and development of semiconductors, materials used to manufacture semiconductors or semiconductor manufacturing equipment.
How to Apply
2023-NIST-CHIPS-SMME-01
NOTICE OF FUNDING OPPORTUNITY (NOFO)
CHIPS Incentives Program – Facilities for Semiconductor Materials and Manufacturing
Equipment
EXECUTIVE SUMMARY
- Federal Agency Name: National Institute of Standards and Technology (NIST), United
States Department of Commerce
- Funding Opportunity Title: CHIPS Incentives Program – Facilities for Semiconductor
Materials and Manufacturing Equipment
- Announcement Type: Initial
- Funding Opportunity Number: 2023-NIST-CHIPS-SMME-01
- Assistance Listing (CFDA Number): 11.037 – CHIPS Incentives Program
- Dates:
For all potential applicants, concept plans will be accepted between December 1,
2023, and February 1, 2024.
o For applications that are invited to advance to the full application phase, the
CHIPS Program Office will communicate full application submission dates to
o applicants individually upon notifying them of their advancement.
The Department of Commerce may amend this NOFO at any time. It may also close the
funding opportunity with at least 60 days’ notice. Changes will be communicated via
https://www.grants.gov and https://www.chips.gov.
- Application Submission Address: https://applications.chips.gov/
Funding Opportunity Description: The CHIPS Incentives Program aims to catalyze long-term
economically sustainable growth in the domestic semiconductor industry in support of U.S.
economic and national security. This is the second Notice of Funding Opportunity under this
program. It seeks applications for projects for the construction, expansion, or modernization of
commercial facilities for semiconductor materials and manufacturing equipment for which the
capital investment falls below $300 million.
CHIPS Incentives Program – Facilities for Semiconductor Materials and Manufacturing Equipment
Notice of Funding Opportunity
Page 1 of 45
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Excerpt from the funding announcement. Read the full announcement.
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